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Lead Free

Tin-Lead alloys have been part of electronic assemblies since they first began to be manufactured.

Any company currently involved in the manufacture of electronic assemblies will most probably be using the standard Tin-Lead alloys for surface mount reflow, wave soldering and hand soldering.

The EC has initiated a proposed Waste in Electronics and Electrical Equipment directive that will eliminate Lead from electronics assemblies by 2004.

Although Lead in electronic assemblies represents less than 2% of lead consumed annually concern has been expressed over the increasing volume of electronic assemblies entering landfills.

As part of the TechnoTrend Environmental Policy the company is actively addressing the issue of Lead in its range of products.

TechnoTrend Lead-Free Evaluation
Key areas to address Replacement Technology Action to date
Surface mount solder paste Tin-Copper-Silver alloy Lead-free paste evaluated - replacement alloy agreed
Wave soldering alloys Tin-Copper-Silver Alloy Assessment ongoing
Wire solder alloys Tin-Silver Alloy Alloys evaluated - production level trials planned
PCB finish Organic Coating Evaluated - larger pre-production trials planned
Through hole component finish Awaiting manufacturer information Assessment ongoing
Surface mount component finish Awaiting manufacturer information Assessment ongoing

If you have any further queries regarding the

TechnoTrend Lead-Free Evaluation

please contact

Sales @ Technotrend Ltd

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